EMI Shielding Laminates
JEMIC can layer a variety of insulating films and conductive materials, which can be designed and manufactured to enclose electronic components, such as printed circuit boards. A typical EMI/RFI shielding configuration is a conductive layer 'sandwiched' between two insulating layers. The lamination is then punched to obtain openings and crease lines. JEMIC Shielding Technology can supply the parts in sheet form, which can then be folded around the electronic component during assembly.
Our EMI shielding laminates are an inexpensive solution for shielding components or entire assemblies. Because EMI shielding laminates are lightweight and flexible, these types of shields are perfect for isolating components already assembled, without the need for extensive redesign and rework. JEMIC Shielding Technology takes pride in our value-added capabilities. We can design, manufacture and apply the shielding all in one location. Let our engineers assist you with your EMI and RF shielding needs for optimum shielding solutions.
Advantages of EMI Shielding Laminates
- Flexible, Robust EMI Shielding Laminates
- Custom Shielding Products Design
- Applied by JEMIC Shielding Technology, or by the Customer
- Low Tooling Cost
- Unlimited Size Options
- High and Low Volume Runs
- Low Overall Shielding Cost